Technical Papers

Chip IR Drop Reduction Through Automated Via Checking and Addition

Posted in: Full-Chip Parasitic Extraction

 Complex physical designs (layouts) in 65 nm and below process nodes often use ten (10) or more layers of metallization. So, the length of supply (power/ground) nets as well as that of clock and signal nets is typically long, and the nets involve multiple layers of Vias. These Vias tend to dominate the impedance due to these nets. It is, therefore, often the case that insufficient Via placements on the junctions between Metal(N) and Metal(N+1) turns out to be the root cause of the IR drop failures, and net delays giving rise to setup and hold time violations. The other detrimental effect of Via-deficient junctions is increased heat dissipation and current crowding leading to electro-migration. Wide metals warping resulting in unreliable Via connections require redundant Via placements. Some Via-deficient junctions may barely meet redundant Via requirements, but additional Vias often make the junctions more robust. This paper discusses a simple Perl-Calibre® approach to check for and add Vias to M(N)-M(N+1) junctions that have insufficient Vias or no Vias, but could hold more Vias without violating the topological design rules checks (DRCs). The Vias are checked for and added to junctions on user-specified nets. Although, typically supply nets (VDD,VSS) are handled by the code, there are actually no restrictions on the net names as long as they are top-level net names that can be traced downwards along metal and via lines, or even other connectivity layers.

Download

Calibre Rule Code Testability: The Good, The Bad, and The Ugly

Posted in: Full-Chip Parasitic Extraction

 Writing Calibre® rule checks is easy. Writing correct, complete, and efficient checks, however, takes more effort. A well-defined business process for software development is a must to ensure good rule sets. This paper focuses on testability and test development as critical components of this process. It also provides an overview of robust SVRF development practices from understanding the intent of the rule, test case development, code development, code reviews, and maintenance of test cases, documentation, and code for the life of the process node. This paper provides tips and tricks to efficiently develop cases to validate that a rule set checks exactly the required rules, with proper handling of corner cases, to prevent the costly mistakes of false errors or missed real errors. It shares practices wherein a good set of test cases and well-developed plan can help transform code from bad or ugly to good.

Download

An Evolution of Gate and Via Parasitic Resistance Extraction

Posted in: Full-Chip Parasitic Extraction

 Cypress has recently modified the parasitic resistance extraction of Vias and Gates. Rather than use a hard number for PEX VIA REDUCTION COUNT for Via grouping, we have found that using FLEXIBLE PEX VIA REDUCTION RESISTANCE for all layers and allowing user specified application of the "STANDARD COUNT" modifier provides nodal reduction and the ability to increase accuracy if needed. For transistor devices, Cypress extracts parasitic resistance to the center of the seed layer, one half the width of gate. Gates only contacted on one side omit one half of the resistance. Experiments have shown that a more accurate estimation is one third. To achieve that accuracy, our flow now uses RESISTANCE DEVICE_SEED to lower poly resistance. Capacitive accuracy is maintained by treating the gate device as poly a equivalent through the use of CAPACITANCE ALIAS. This paper presents details on the evolution of our parasitic resistance flow.

Download

Computation of parasitic capacitances of an IC cell in accounting for photolithography effect

Posted in: Full-Chip Parasitic Extraction
Today's sub-wavelength IC design needs the reticle enhancement technology (RET) such as optical proximity correction (OPC) to correct optical distortion due to photolithography effect. However the difference between the drawn layout and the actual print image persists. To accurately predict the interconnect parasitics such as resistances and capacitances, the impact of optical distortion needs to be considered. This paper presents the computation of parasitic capacitances of an IC cell in accounting for optical distortion by using a three dimensional field solver. The results offer a better understanding of the impact of optical image on the accuracy of parasitic capacitances and provide an overview for further optical effect modeling and post OPC extraction.
Download

Further Reducing the High Cost of Processing Power

Posted in: Full-Chip Parasitic Extraction
The characteristics of today's complex IC designs are making accelerated
processing of design data an essential part of design-to-silicon flows.
To achieve profitability, design houses and fabs alike must be able to
process huge and complicated volumes of design data swiftly. Turn around
time (TAT) must be held to a minimum to ensure that designs are readied
for manufacturing as quickly as possible in order to keep costs low and
take advantage of volatile windows of opportunity in the marketplace.
With Calibre(r) MT or MTflex, TAT is reduced and throughput is
increased. For large IDMs or foundries that must process several jobs,
hardware configurations can be better utilized to optimize the total
number of jobs that can run through in any given day.
Download

A Fully Automated Approach for Analog Circuit Reuse

Posted in: Full-Chip Parasitic Extraction

Demonstrated in this paper is a technique for automatic circuit resizing between different technologies. It is not based on any optimization techniques, but rather relies on a new algorithm based on knowledge extraction, which makes it a very fast technique. This technique studies the original design and extracts its major features (basic devices & blocks features, device matching, parasitics, symmetry) and then produces a re-sized design in the target technology with the same performance as the original design. The migration of a low voltage Delta Sigma modulator is presented in this paper to validate the migration engine.

Download

Calibre MTflex: Reducing the High Cost of Processing Power

Posted in: Full-Chip Parasitic Extraction
The characteristics of today's complex IC designs are making accelerated processing of design data an essential part of design-to-silicon flows. To achieve profitability, design houses and fabs alike must be able to process huge and complicated volumes of design data swiftly.
Download

Electron Transport Through Metal-Multiwall Carbon Nanotube Interfaces

Posted in: Full-Chip Parasitic Extraction
In this paper, we examine mechanisms of electron transport across the metal-carbon nanotube (CNT) interface for two different types of multiwall carbon nanotube (MWNT) architectures, horizontal or side-contacted MWNTs and vertical or end-contacted MWNTs. Horizontally aligned nanotube growth and electrical characteristics are examined with respect to their potential applications in silicon-based technologies. Recent advances in the synthesis techniques of vertical MWNTs have also enhanced the possibility for a manufacturable solution incorporating this novel material as on-chip interconnects or vias as copper interconnect feature sizes are scaled into the sub-100-nm regime. A vertical MWNT architecture is presented that may be suitable for integration into silicon-based technologies. The growth method for this architecture and its effect on electrical characteristics are examined. Through simulations, dc measurements, and comparison of our results with previous studies, we explain why high contact resistance is observed in metal-CNT-metal systems.
Download

Resistance Matrix in Crosstalk Modeling for Multiconductor Systems

Posted in: Full-Chip Parasitic Extraction
A complete modal analysis is introduced to derive the crosstalk voltage waveform in multiconductor coupled systems. In addition to the capacitance and inductance matrices, it also includes a resistance matrix. The off-diagonal terms of the resistance matrix are related to the return path, which is important for accurate noise modeling at high frequency. It is shown that the error in crosstalk peak noise can be as high as 30% if the return path resistance is ignored. This work completes a previous modal analysis of a multiconductor system and significantly improves accuracy of crosstalk noise estimation, which is becoming increasingly important in design of deep-submicron integrated circuits.
Download
© Mentor Graphics Corp. All rights reserved.