Technical Papers

Implementation-Quality Prototyping With Olympus-SoCTM: Accelerating Design Closure for Advanced ICs

Posted in: Chip-Level Floorplan & Place & Route

 The growing complexity of today’s ICs and tight market schedules are driving a demand for more powerful solutions for design prototyping. Prototyping helps designers determine the feasibility of implementing a particular design given the various requirements. By using Olympus-SoC for rapid prototyping early in the design cycle, designers can catch issues with macro placement, missing constraints, RTL problems, and many other design problems. In this paper, we show how design prototyping with the Mentor Graphics Olympus-SoC physical implementation system improves predictability and facilitates design closure.

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Confronting Chip Assembly Challenges: Avoid Late-Stage Bottlenecks in Physical Design

Posted in: Chip-Level Floorplan & Place & Route

 The increasing size and complexity of today’s multi-million gate SoCs necessitates hierarchical chip design methodologies, which partition the chip into smaller pieces. A hierarchical methodology is necessary for large SoCs because it extends the capacity of design-automation tools, improves tool runtimes, and limits last minute design changes. However, even hierarchical flows using the current-generation of physical implementation tools are facing problems closing the chip requirement within aggressive schedules. In this paper, we review chip assembly challenges and discuss the requirements of an implementation system that comprehensively addresses all the issues.

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Design for Variability: Managing Design, Process, and Manufacturing Variations in Physical Design

Posted in: Chip-Level Floorplan & Place & Route

 At nanometer technologies, variability has become one of the leading causes for chip failures and delayed schedules. For nanometer design implementation flows, variability is associated with design modes, power states, environmental conditions, manufacturing steps, and the behavior of devices and interconnects. Variability affects the entire physical design environment, from power management, through timing and signal integrity closure, to manufacturability.

This paper explores the different forms of variability, reviews the challenges involved in modeling variability, and discusses the requirements of an implementation system that comprehensively analyzes and optimizes a design for best results in the presence of variability.

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Implementation-Quality Prototyping With Olympus-SoCTM: Accelerating Design Closure for Advanced ICs

Posted in: Chip-Level Floorplan & Place & Route
In this white paper we discuss how Pinnacle's prototyping capabilities add significant value to current design flows. We first discuss how Pinnacle Prototyping helps engineers in the early design phase to refine and finalize the floorplan and complex design constraints. Next, we show how Pinnacle can save months by accounting for late stage effects: timing problems seen at various operating modes or corners, on-chip variation induced setup and hold violations, power issues seen later in design flow due to multi-corner and multi-mode fixing, and clock tree synthesis related congestion. Pinnacle gives designers the ability to identify these implementation issues early in the design cycle. By using Pinnacle Prototyping designers can significantly reduce time to best results.
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Confronting Chip Assembly Challenges: Avoid Late-Stage Bottlenecks in Physical Design

Posted in: Chip-Level Floorplan & Place & Route

At nanometer technologies, IC physical design teams are designing multi-million gate products with very complex functionality including different processor cores, memory blocks, and analog circuitry on a single chip. In addition to addressing the sheer size and complexity, designers also need to deal with variations in design modes, environmental conditions, manufacturing steps, and device and interconnect behavior. In recent years, hierarchical approaches have gained traction for the implementation of multi-million gate SOCs. However, at these design sizes, flows using the current-generation of physical implementation severely strained to meet the chip specifications with aggressive schedules.

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Further Reducing the High Cost of Processing Power

Posted in: Chip-Level Floorplan & Place & Route
The characteristics of today's complex IC designs are making accelerated
processing of design data an essential part of design-to-silicon flows.
To achieve profitability, design houses and fabs alike must be able to
process huge and complicated volumes of design data swiftly. Turn around
time (TAT) must be held to a minimum to ensure that designs are readied
for manufacturing as quickly as possible in order to keep costs low and
take advantage of volatile windows of opportunity in the marketplace.
With Calibre(r) MT or MTflex, TAT is reduced and throughput is
increased. For large IDMs or foundries that must process several jobs,
hardware configurations can be better utilized to optimize the total
number of jobs that can run through in any given day.
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A Fully Automated Approach for Analog Circuit Reuse

Posted in: Chip-Level Floorplan & Place & Route

Demonstrated in this paper is a technique for automatic circuit resizing between different technologies. It is not based on any optimization techniques, but rather relies on a new algorithm based on knowledge extraction, which makes it a very fast technique. This technique studies the original design and extracts its major features (basic devices & blocks features, device matching, parasitics, symmetry) and then produces a re-sized design in the target technology with the same performance as the original design. The migration of a low voltage Delta Sigma modulator is presented in this paper to validate the migration engine.

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Calibre MTflex: Reducing the High Cost of Processing Power

Posted in: Chip-Level Floorplan & Place & Route
The characteristics of today's complex IC designs are making accelerated processing of design data an essential part of design-to-silicon flows. To achieve profitability, design houses and fabs alike must be able to process huge and complicated volumes of design data swiftly.
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Bluetooth Transceiver Design: A Top-Down Flow for Complex RF Mixed-Signal ICs

Posted in: Chip-Level Floorplan & Place & Route
This paper describes the design challenges of BlueTraCTM, a low-cost, low-power radio transceiver. It details how a topdown methodology along with mixed-signal/mixed-mode techniques and behavioral modeling can be used to effectively address and solve the design challenges of this complex RF mixed-signal IC. The methodology leverages an out-of-the-box design flow from Mentor Graphics that includes Design Architect-IC for design entry and simulation control, ADVance MS (ADMS) for single-kernel mixed-mode simulation, IC Station for schematic-driven physical layout, and Calibre for physical verification and extraction.
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